PH-722 Accelerator Techniques for Materials:  (2+1) credit hours

Theory: 2 credit hours

  1. Introduction to Ion-Solid Interactions:
    Type of ion solid interactions; Low and High energy ions; Nuclear Energy loss and electronic energy; Defects production using ion beam techniques; The applications of introduced defects on material properties.
  2. Accelerators and Applications
    Introduction to Electrostatic Accelerators; Relevant detectors and instrumentation; Accelerators for industrial and medical applications; Ion Implantation and ion beam analysis techniques: Rutherford Backscattering Spectroscopy (RBS), Proton Induced X-Ray Emission (PIXE), Elastic Recoil Detection analysis (ERD).
  3. Rutherford and Non-Rutherford Backscattering Spectroscopy
    Introduction, Applications, Kinematics [Kinematic factors, Rutherford scattering cross section, RBS system, mass resolution, energy resolution, depth resolution basic concepts, Energy loss, Analysis of thin and thick target samples, measurement of film thickness, depth profiling of impurities in the deposited films and of implanted species.
  4. Elastic Recoil Detection analysis (ERDA) and Nuclear reaction analysis (NRA)
    Introduction, Kinematics, Applications, Depth profiling of light elements in heavy materials, Techniques for profiling H; Using standard for concentration measurement and methods to improve the experimental statistics.
  5. Proton Induced X-Ray Emission (PIXE)
    Proton Induced X-Ray Emission,:Principle, Application, Analysis of spectrum, Quantitative Spectrum fitting, experimental setup, use of external beam, Nuclear microprobe, Analysis of single Aerosol Particle.


Experiments: 1 credit hour
Experiments will be conducted at 5-UDH tandem Accelerator Lab in Experimental Physics Labs (EPD). The proposed list of experiments for the basic understanding and learning of ion beam analysis techniques is as follows:

  1. Ion implantation and sample preparation for Rutherford Backscattering  Spectroscopy
  2. Channels to energy calibration and measurements of deposited film thickness
  3. Concentration determination of incorporated impurities and implanted species in the substrate 
  4. Hydrogen depth profiling
  5. Particle Induced X-ray Emission
  6. Gamma ray spectroscopy using NaI detector


Reference Books